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  lg m470 mini topled rg through-hole vorl?ufige daten / preliminary data 2001-07-30 1 besondere merkmale ? geh ? usetyp: wei ? es smt-geh ? use  besonderheit des bauteils: extrem breite abstrahlcharakteristik; bauteil wird top-down montiert und strahlt durch das pcb; ideal f r hinterleuchtungen und einkopplungen in lichtleiter  wellenl ? nge: 570 nm  abstrahlwinkel: lambertscher strahler (120 )  technologie: gap  optischer wirkungsgrad: 2,5 lm/w  gruppierungsparameter: lichtst ? rke  verarbeitungsmethode: f r alle smt-best cktechniken geeignet  l ? tmethode: ir reflow l ? ten  vorbehandlung: nach jedec level 2  gurtung: 12-mm gurt mit 3000/rolle, ? 180 mm oder 11800/rolle, ? 330 mm anwendungen  optischer indikator  einkopplung in lichtleiter  hinterleuchtung (lcd, handy, schalter, tasten, displays, werbebeleuchtung, allgemeinbeleuchtung)  innenbeleuchtung im automobilbereich (z.b. instrumentenbeleuchtung, u. ? .) features  package: white smt package  feature of the device: extremely wide viewing angle; led is mounted top down and emits through the pcb; ideal for backlighting and coupling in light guides  wavelength: 570 nm  viewing angle: lambertian emitter (120 )  technology: gap  optical efficiency: 2.5 lm/w  grouping parameter: luminous intensity  assembly methods: suitable for all smt assembly methods  soldering methods: ir reflow soldering  preconditioning: acc. to jedec level 2  taping: 12-mm tape with 3000/reel, ? 180 mm or 11800/reel, ? 330 mm applications  optical indicators  coupling into light guides  backlighting (lcd, cellular phones, switches, keys, displays, illuminated advertising, general lighting)  interior automotive lighting (e.g. dashboard backlighting, etc.)
2001-07-30 2 lg m470 anm.: -1 gesamter farbbereich die standardlieferform von serientypen beinhaltet eine untere bzw. eine obere familiengruppe, die aus nur 3 bzw. 4 halbgruppen besteht. einzelne halbgruppen sind nicht erh?ltlich. in einer verpackungseinheit / gurt ist immer nur eine halbgruppe enthalten. note: -1 total color tolerance range the standard shipping format for serial types includes a lower or upper family group of 3 or 4 individual groups. individual half groups are not available. no packing unit / tape ever contains more than one luminous intensity half group. typ type emissions- farbe color of emission farbe der lichtaustritts- fl ? che color of the light emitting area lichtst ? rke luminous intensity i f = 10 ma i v (mcd) lichtstrom luminous flux i f = 10 ma v (mlm) bestellnummer ordering code lg m470-j2k2-1 lg m470-k2m1-1 green colorless clear 5.6 ... 11.2 9.0 ... 22.4 25 (typ.) 45 (typ.) q62703-q6023 q62703-q6166
lg m470 2001-07-30 3 grenzwerte maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebstemperatur operating temperature range t op ? 40 ? + 100 c lagertemperatur storage temperature range t stg ? 40 ? + 100 c sperrschichttemperatur junction temperature t j + 100 c durchlassstrom forward current i f 30 ma sto ? strom surge current t 10 s, d = 0.005 i fm 0.5 a sperrspannung reverse voltage v r 5v leistungsaufnahme power consumption p tot 95 mw w ? rmewiderstand thermal resistance sperrschicht/umgebung junction/air sperrschicht/l ? tpad junction/soldering point montage auf pc-board fr 4 (padgr ?? e 16 mm 2 ) mounted on pc board fr 4 (pad size 16 mm 2 ) r th ja r th js 480 270 k/w k/w
2001-07-30 4 lg m470 kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl ? nge des emittierten lichtes (typ.) wavelength at peak emission i f = 10 ma peak 572 nm dominantwellenl ? nge 1) (typ.) dominant wavelength 1) i f = 10 ma dom 570 ?6 nm spektrale bandbreite bei 50 % i rel max (typ.) spectral bandwidth at 50 % i rel max i f = 10 ma ? 25 nm abstrahlwinkel bei 50 % i v (vollwinkel) (typ.) viewing angle at 50 % i v 2 ? 120 grad deg. durchlassspannung 2) (typ.) forward voltage 2) (max.) i f = 10 ma v f v f 2.0 2.5 v v sperrstrom (typ.) reverse current (max.) v r = 5 v i r i r 0.01 10 a a temperaturkoeffizient von peak (typ.) temperature coefficient of peak i f = 10 ma; ? 10 c t 100 c tc peak 0.11 nm/k temperaturkoeffizient von dom (typ.) temperature coefficient of dom i f = 10 ma; ? 10 c t 100 c tc dom 0.07 nm/k temperaturkoeffizient von v f (typ.) temperature coefficient of v f i f = 10 ma; ? 10 c t 100 c tc v ? 1.4 mv/k optischer wirkungsgrad (typ.) optical efficiency i f = 10 ma opt 2.5 lm/w 1) wellenl ? ngen werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 1 nm ermittelt. wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm. 2) spannungswerte werden mit einer stromeinpr ? gedauer von 1 ms und einer genauigkeit von 0,1 v ermittelt. voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 v.
lg m470 2001-07-30 5 helligkeitswerte werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 11% ermittelt. luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11%. helligkeits-gruppierungsschema luminous intensity groups lichtgruppe luminous intensity group lichtst ? rke luminous intensity i v (mcd) lichtstrom luminous flux v (mlm) j2 k1 k2 l1 l2 m1 5.6 ... 7.1 7.1 ... 9.0 9.0 ... 11.2 11.2 ... 14.0 14.0 ... 18.0 18.0 ... 22.4 19 (typ.) 24 (typ.) 30 (typ.) 40 (typ.) 50 (typ.) 60 (typ.) gruppenbezeichnung auf etikett group name on label beispiel: l1 example: l1 lichtgruppe luminous intensity group halbgruppe half group l1
2001-07-30 6 lg m470 relative spektrale emission i rel = f ( ), t a = 25 c, i f = 10 ma relative spectral emission v( ) = spektrale augenempfindlichkeit standard eye response curve abstrahlcharakteristik i rel = f ( ? ) radiation characteristic % rel ohl01098 100 80 60 40 20 0 400 450 500 550 600 650 700 nm i green v 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl01660 50? 60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120?
lg m470 2001-07-30 7 durchlassstrom i f = f ( v f ) forward current t a = 25 c maximal zul ? ssiger durchlassstrom i f = f ( t a ) max. permissible forward current relative lichtst ? rke i v / i v(10 ma) = f ( i f ) relative luminous intensity t a = 25 c relative lichtst ? rke i v / i v (25 c)= f ( t a ) relative luminous intensity i f = 10 ma 10 -1 v 5 ohl01263 i f f v 0 10 1 10 2 10 5 ma 1 1.4 1.8 2.2 2.6 3 3.4 t ohl00231 0 f i 02040 60 80 c 100 ma 10 20 30 40 t a t s temp. solder point t s temp. ambient t a v v (10ma) 10 -1 0 10 10 12 10 ma 10 -3 5 ohl02313 f i 5 -2 10 5 -1 10 0 10 1 10 i i 55 green green 0 ohl01101 ? c a t 0 20 40 60 80 100 v v (25 ? c) i i 0.4 0.8 1.2 1.6 2
2001-07-30 8 lg m470 zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c ohl01686 s 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t d i t t p f t p = d = 0.005 0.01 0.02 0.05 0.2 0.5 dc 10 1 5 i f t 2 10 0.1 p 10 3 ma
lg m470 2001-07-30 9 ma ? zeichnung package outlines ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). kathodenkennung: abgeschr ? gte ecke cathode mark: bevelled edge gewicht / approx. weight: 10 mg gply6069 0.9 (0.035) 0.1 (0.004) 2.0 (0.079) 1.0 (0.039) 0.2 (0.008) 4.0 (0.157) 0.1 (0.004) 1.4 (0.055) 0.1 (0.004) 2.44 (0.096) 2.52 (0.099) 0.1 (0.004) cathode marking 0.4 (0.016) 0.6 (0.024) 1.3 (0.051) cathode typ. 1.5 (0.059) x 1.0 (0.039) light emitting window 0.35 (0.014) 0.1 (0.004) 1.5 (0.059) 1.1 (0.043) pick up area 1.3 (0.051) 0.6 (0.024) 1.3 (0.051) marking
2001-07-30 10 lg m470 l ? tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 ir-reflow l ? tprofil (nach ipc 9501) ir reflow soldering profile (acc. to ipc 9501) ohly0597 0 0 50 100 150 200 250 50 100 150 200 250 300 t t ? c s 240-245 ? c 10-40 s 183 ? c 120 to 180 s defined for preconditioning: up to 6 k/s ramp-down rate up to 6 k/s ramp-up rate up to 6 k/s defined for preconditioning: 2-3 k/s
lg m470 2001-07-30 11 empfohlenes l ? tpaddesign ir reflow l ? ten recommended solder pad ir reflow soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohpy1438 +0.1 (0.004) 2.7 (0.106) hole in pcb solder resist l ? tstopplack 1.1 (0.043) 0.6 (0.024) 3 (0.118) padgeometrie f ? r verbesserte w ? rmeableitung heat dissipation paddesign for improved
2001-07-30 12 lg m470 gurtung / polarit ? t und lage verpackungseinheit 3000/rolle, 180 mm oder 11800/rolle, 330 mm method of taping / polarity and orientation packing unit 3000/reel, 180 mm or 11800/reel, 330 mm ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohay1358 1.5 (0.059) 2 (0.079) 4 (0.157) 1.55 (0.061) 4 (0.157) 5.5 (0.217) 1.75 (0.069) 12 (0.472) 4.3 (0.169) 2.2 (0.087) a c
lg m470 2001-07-30 13 published by osram opto semiconductors gmbh & co. ohg wernerwerkstrasse 2, d-93049 regensburg ? all rights reserved. attention please! the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserved. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. if printed or downloaded, please find the latest version in the internet. packing please use the recycling operators known to you. we can also help you get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. revision history: 2001-07-30 previous version: 2001-02-14 page subjects (major changes since last revision)


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